Abstract
The newly developed TiAlSiN/CrN multilayer films were deposited on silicon Si (100) substrates and tungsten carbide steel substrates by high power impulse magnetron sputtering technique (HiPIMS) at 80 °C working temperature. The effect of modulation structure on the microstructural and mechanical properties of thin films was analyzed systematically by TEM, SEM, XRD, nanoindenter, Scratch test, and Rockwell indenter. The grain size of columnar crystals decreases as increasing the Λ from 2 nm to 27 nm. Correspondingly, the crystallite size in the (111) and (200) directions exhibited an increasing tendency, which calculated by the Debye-Scherrer equation. The hardness and Young's modulus exhibited an initial increased with decreasing Λ from 27 nm to 7.5 nm, followed by a decrease. The TiAlSiN/CrN multilayer films with Λ of 7.5 nm reached the highest hardness of 26.6 GPa and the highest Young's modulus of 295.4 GPa. However, the thin film with Λ of 8.5 nm exhibited a hardness value of 25.3 GPa and the highest adhesion strength, which the highest critical load Lc1 of 52 GPa and the morphology of Rockwell indentations can be classified as HF1. Therefore, based on both hardness and adhesion strength, an optimization TiAlSiN/CrN multilayer film is in the single layer thickness of 8.5 nm.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
