Abstract
AbstractIn this study, we developed a system allowing interfacial adhesion measurements as a function of mode-mixity, from pure tension to pure shear. Results show that the debonding energy increases, by a factor of 3 to 10, as the amount of shear stress increases, approaching mode II conditions. For low k dielectrics, the debonding energy was found to decrease with increasing porosity and increase with increasing plasticity. The crack propagation is also dependent on mode-mixity.
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