Abstract
In order to explore the effect of addition of mixed rare earths (MRE) on the wetting behavior and interfacial reaction between Sn-0.70Cu-0.05Ni solder and amorphous Fe84.3Si10.3B5.4 alloy, 0.25 wt.% percentage of the MRE, which are mainly elements La and Ce, were added into the solder. Results show it can refine the microstructure of the solder alloy, and there is limited change of melting temperature with the addition of MRE in the solder. The wettability of the solder on amorphous substrate is improved by adding 0.25 wt.% percentage of the MRE into Sn-0.70Cu-0.05Ni solder. Moreover, research results indicate that, with the increase of wetting temperature, the final equilibrium wetting angles of Sn-0.70Cu-0.05Ni and Sn-0.70Cu-0.05Ni-0.25MRE on amorphous substrate decrease gradually, indicating the better wettability at the higher wetting temperature. In addition, with the increase of temperature, the distribution of intermetallic compound (IMC) FeSn2 formed at the interface between the two solders and amorphous substrate is changed from discontinuous state to continuous state. The thickness of the interfacial IMC layer between solder and amorphous substrates reduced with the addition of MRE, indicating that the presence of 0.25 wt.% percentage of the MRE is effective in suppressing the growth of IMC layer.
Highlights
Physical and chemical properties, amorphous alloys are ideal materials for aviation and spacecraft structures owing to the high specific strength, which is vital in the field of aerospace[1]
The initial point of the DSC heating curve is recognized as the solidus temperature while the peak point is considered to be the liquidus temperature of solders[7]
It can be concluded that the addition of mixed rare earths (MRE) has a slight influence on the melting temperature of Sn-0.70Cu-0.05Ni solder
Summary
Physical and chemical properties, amorphous alloys are ideal materials for aviation and spacecraft structures owing to the high specific strength, which is vital in the field of aerospace[1]. At present, the critical sizes of amorphous alloys with excellent deformability prepared by fast cooling method are limited within millimeters, constraining their wide applications as engineering materials[2]. In order to overcome the size limitation and spread their applications, it is necessary to explore appropriate joining techniques to obtain larger size amorphous alloys. As a low temperature joining process, soldering is an effective and reliable technique because of the advantage of little influence on the structure of amorphous alloys. The good wettability and interfacial reaction of solders on the amorphous alloys are prerequisites for the high soldering reliability. The research on the wetting behavior and the interfacial reaction between solders and amorphous alloys are of great significance
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