Abstract
The effect of microcracking on the thermal diffusivity of polycrystalline Fe2TiO5 subjected to a range of annealing treatments was investigated. At fine grain size (∼1 μm), the thermal diffusivity exhibited the decrease with increasing temperature common for dielectrics. Extensive microcracking in the larger‐grain‐sized materials significantly decreased their thermal diffusivity. On heating, the microcracked materials exhibited increased thermal diffusivity at elevated temperatures which can be attributed primarily to microcrack closure and healing; on cooling, they exhibited a pronounced hysteresis, attributable to irreversible crack opening and closing. Thermal cycling closed the hysteresis curves, which suggests permanent changes in microcrack morphology. It appears that microcracking is a promising technique for tailoring ceramic materials to a combination of high thermal shock resistance and good insulating capability.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
