Abstract

In the case of valuable cold-rolled Cu/Al clad plates, billet surface treatment before rolling is a significant process that can affect the bonding efficiency and quality. While the current studies primarily focus on the influence of rolling parameters, insufficient attention has been paid to surface treatment. In this study, the effects of mechanical surface treatment on the bonding mechanism and bonding properties of cold-rolled Cu/Al clad plates were investigated. The results showed that different mechanical surface treatments have significant effects on the surface morphology, roughness, and residual stress. In addition, the effect of surface mechanical treatment on bonding quality was also observed to be critical. When the grinding direction was consistent with the rolling direction (RD), the bonding quality of the Cu/Al clad plates was significantly improved. After surface treatment along the RD for 20 s, the Cu/Al clad plates showed the highest shear strength (78 MPa), approximately four times as high as that of the unpolished samples. Simultaneously, the peel strength of this process was also significantly higher than that achieved via the other processes. Finally, on the basis of the surface morphology, roughness, and residual stress, the effect of surface treatment on the bonding mechanism and bonding properties of Cu/Al clad plates was analyzed. This study proposes a deeper understanding of the bonding behavior and bonding mechanism for cold rolled clad plates processed via mechanical surface treatment.

Highlights

  • Cu/Al clad plates inherit the high electrical conductivity, thermal conductivity, and formability from the substrate metals, and possess the advantages of high corrosion resistance and precious metals conservation

  • Before the cold rolling bonding (CRB) process, the initial surface of the Cu and Al plates was ground via four different mechanical surface treatments: the parallel rolling direction grinding (PRDG) process, vertical rolling direction grinding (VRDG) process, 90° cross grinding (90° CG: VRDG + PRDG) process, and rotating wire brush grinding (RWBG) process

  • The brittle/hardening layer with many scratches can be formed on the surface after grinding with a wire brush [17]

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Summary

Introduction

Cu/Al clad plates inherit the high electrical conductivity, thermal conductivity, and formability from the substrate metals, and possess the advantages of high corrosion resistance and precious metals conservation. They can be widely used in electronic communication, mechanical power transmission, architectural decoration, and daily necessities [1]. Little research has focused on the surface treatment before rolling.

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