Abstract
The effects of temperature cycling from −40°C to 250°C on the active metal brazing (AMB) substrates were investigated using silicon nitride ceramics or aluminum nitride ceramics with different fracture toughness and strength. Visual inspection of the substrates after 1000 cycles hardly detected failure in the Si 3 N 4 -AMB substrates with the high fracture toughness of 8.0 MPa·m1/2. By contrast, the Si 3 N 4 -AMB substrates with the lower fracture toughness of ca. 5 MPa·m1/2 exhibited delamination of the Cu layer at only 20 or 50 thermal cycles. Detachment of the Cu layer occurred at seven cycles when the AlN-AMB substrates with fracture toughness of 3.2 MPa·m1/2 were employed. It was found that the endurance to thermal fatigue of AMB substrates was controlled by the fracture toughness of ceramic substrates rather than the fracture strength.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.