Effect of Matte-Sn Electroplating Parameters on the Thermo-mechanical Reliability of Lead-free Solder Joints

Abstract

Most of the Cu/Cu alloy lead-frames of electronic components used for automotive applications contain electroplated matte-Sn terminal finish to improve the wettability of Sn-based Pb-free solders during reflow soldering process. When the solder joints are subjected to combined thermal and mechanical cyclic loading, the influence of matte-Sn electroplating parameters can lead to early and brittle failure of the solder joint. To test this hypothesis, a factorial design of experiments (DOE) has been conducted with LFPAK-MOSFET (hereafter referred to as LFPAK) components plated with different matte-Sn electroplating parameters and reflow soldered with two solder alloys (SAC 305 and Innolot). The LFPAK solder joints were then subjected to thermo-mechanical in-phase cyclic loading under different strain amplitudes. No electrical measurement is done to eradicate the effect of electrical current on the solder joint. The response to the DOE is the crack percentage obtained in the LFPAK solder joints after 1000 and 2000 cycles. The Innolot solder joints exhibited lower crack percentages than the SAC 305. The level of organic additives in the electroplating process of matte-Sn influences the failure mode of the solder joint. Microstructural investigation attributes the nature of failure to the morphology of the (Cu,Ni)6Sn5 IMC phase that forms on the component side of the solder joint.