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Abstract
The effect of material properties of anisotropic conductive films (ACFs) on the reliability of chip on glass (COG) assemblies was investigated. Two types of ACF were used in this study. ACF-A (50 wt%) is designed to have higher rubber resin content than ACF-B (11 wt%), in order to reduce the warpage of COG assembly. From the study on basic material properties, such as elastic modulus (E′), coefficient of thermal expansion (CTE) and glass transition temperature (Tg), ACF-B showed better properties than ACF-A. The temperature cycle reliability test showed that there were little differences between two ACF COG assemblies in spite of their different warpage level. But, results of high temperature storage test (100°C and 1000 hours) exhibited that the ACF-B COG assembly showed better performances due to the better material properties of ACF-B.
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