Abstract
The paper presents a high-rate method for metal coating deposition by the means of magnetron sputtering system (MSS) with liquid-phase target. Maximum copper deposition rate at a power density of 55 W/cm2 is 200 nm/s, which is twenty times higher than if an ordinary magnetron is used. The effect of material of the crucible on operation of MSS with liquid-phase target and copper coating deposition rate is studied. It is demonstrated that using the crucible with a lower emissivity allows the several-fold increase in deposition rate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
