Abstract
In this study, the D-type latch devices with Ceramic Flat Package (CFP) and Shrink Small-Outline Package (SSOP) were tested and analyzed by experimental means. The effects of manufacturing technics on the pin structure, wire bond, chip layout design, die attach and temperature-affected electrical performance were subsequently investigated. Results show that manufacturing technics with CFP package possesses thicker special pin coatings, thicker different wire bond, stable and effective die attach compared with SSOP package. Meanwhile, the bare dies of two devices exhibit same layout structure design but different longitudinal dimensions. The temperature-affected electrical performances including voltage, current and propagation delay time reveal that the temperature sensitive parameters of CFP latch (variation about 1%) display 12 times better stability than that of SSOP latch (distinct variation about 12%) from −55 °C to 125 °C. Meanwhile, the SSOP latch displays 41.8% better switching speed and working frequency than CFP latch with similar other electrical parameters at room temperature.
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