Abstract
Residual stresses and stress transients in a polycrystalline diamond compact tool were numerically predicted for different pressure and temperature manufacturing conditions. Results showed maximum tensile and compressive stresses of about 500MPa and −125MPa, respectively. However, stress transients during the manufacturing process were up to 2–3 times higher. These depend on how pressure and temperature are removed following the sintering process. Rapid cooling and pressure removal result in high stress transients and vice-versa. These transients can lead to the formation of micro-cracks and delamination of the polycrystalline diamond layer from its substrate, contributing to premature failure of the tool. On the other hand, lower cooling rates and gradual pressure removal offer low stress transients and a favourable final residual stress-state of the PDC tool.
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