Effect of low‐temperature processing on dry film photoresist properties for flexible electronics

Abstract

AbstractThis study presents the mechanical characterization of the dry film photoresist PerMX and its adhesion properties when laminated onto Kapton® E (PI) and Melinex® ST506 (PET). Additionally, the processing temperature, the adhesion strength, and the neutral plane position are investigated and optimized. A relatively low‐temperature (85 °C) process is developed to protect the integrity of the polymers with low glass transition temperature and reduce the thermal mismatch stress. Reduction in processing temperature led to a decrement in the adhesion strength. To counteract this unwanted effect, surface treatments (oxygen plasma) are performed on the polymer surface before lamination. Using the latter techniques, adhesion of PerMX to PET (hard bake: 1 h at 85 °C) is increased from 0.07 to 0.26 N mm−1 (variation of 270%). Finally, the mechanical robustness is investigated and increased by tuning the position of the neutral plane, after 50,000 bending cycles and a radius of curvature of 2.5 mm. © 2013 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2013