Effect of low-pressure plasma treatment on the thermal behaviour of organo-modified montmorillonite nanoclay

Abstract

The thermal behaviour of nanoclay can be considered an important factor in obtaining high-performance polymer nanocomposite. Thus, the current study aims to investigate the effect of plasma treatment on the thermal stability of two organically modified nanoclays, Cloisite 30B (C30B) and Nanomer I.34TCN (I.34TCN), compared with pristine NaMMT.The nanoclays were studied and characterised using Thermogravimetric Analysis (TGA). TGA was used to measure the weight loss of the plasma-treated and untreated nanoclays (C30B, I.34TCN, and NaMMT nanoclays) over a 30-630 C temperature range.Based on TGA results, the decomposition of all plasma-treated nano clays (C30B, I.34TCN and pristine NaMMT) was shifted to a lower temperature than in the untreated ones at all those stages. Thus, plasma treatment was successfully used as a convenient method to alter the chemical structure and surface morphology of MMT nanoclays for better thermal behaviour and filling distribution.This hypothesis can be corroborated by X-ray Diffraction (XRD) and Scanning Electron Microscopy (SEM) for a better understanding of the structural and surface changes that occurred due to the plasma action, which can provide an interpretation of the changes in the thermal behaviour of nanoclays.The plasma treatment, therefore, can improve the thermal stabilisation of the nanocomposite powders for the LS fabricated parts and even for the surrounding powder for the recovery process. Plasma-treated nano clay, therefore, can be used to reinforce polymers with an expectation of increasing the thermal stability of the resultant composites. Thus, the plasma-treated composite can be fabricated for laser sintering applications in fields that require high thermal stability.The surface modification of nanoclay powders via plasma treatment can be used as a convenient method to alter the chemical structure and surface morphology for better thermal behaviour and filling distribution.