Abstract
Low temperature thermal aging influences the rheological properties of epoxy based thermoset molding compounds. Moldability performance is strongly affected by changes in the rheology of the compound. Influence of thermal aging at 35°C of a typical semiconductor grade novolac epoxy molding compound on resin molecular size distribution, curing behavior, and moldability performance has been investigated. Thermal aging has been observed to result inreactive linking of the constituent epoxy and phenol novolac resin system. The extent of linking of the constituent resin system has been observed to influence the curing behavior of the molding compound as measured by differential scanning calorimetry, spiral flow length, and ram follower viscosity measurement techniques. Moldability defects parameters, such as incomplete encapsulation and resin‐bleed onto the leads of the packages during transfer molding process, have been found to be intimately connected with the curing behavior of the molding compound.
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