Abstract
The effects of Cu content on the electrical and structural properties of Ag-Cu thin films were studied before and after microwave processing. Copper was chosen as the alloying element because of its low solubility in Ag, which enables it to segregate at the surface. After microwave annealing, enhanced electrical and structural properties were observed. The results from Rutherford backscattering spectrometry, x-ray diffraction, and four-point probe measurements suggested that the resistivity is controlled by the residual copper concentration and increased grain growth during the low-temperature microwave anneals. For each particular copper concentration, microwave annealing resulted in highest Hall mobility and lowest resistivity. These findings opened the possibility for novel materials structures based on low-temperature microwave processing schemes.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
