Effect of Long-Term Thermal Exposures on Microstructure and Impression Creep in 304HCu Grade Austenitic Stainless Steel

Abstract

This paper presents the results of microstructural evolution and mechanical properties in 304H Cu grade austenite stainless (SS 304HCu) during long-term exposure at high temperatures. The predicted phase composition as a function of temperature obtained using JMatPro® software was confirmed in conjunction with the microstructural evolution characterized by scanning and transmission electron microscopy. Microstructures revealed primary Nb(C,N), M23C6 precipitates at γ-grain boundaries, fine secondary Nb(C,N) intragranular carbides, and a uniform precipitation of <40-nm-sized spherical Cu-rich phase after thermal aging for 10,000 hours at 903 K (630 °C). The impression creep rate at 300 MPa increased by a factor of 20 between 873 K and 923 K (600 °C and 650 °C). The creep rate at 903 K (630 °C) was found to moderately reduce with aging time, signifying the role of Cu-rich phase in improving the creep resistance. The deformation zones and the recrystallization behavior of the plastic zone in creep tested specimen was assessed using Electron backscatter diffraction technique.