Abstract

Additive technologies have several advantages over conventional manufacturing, such as the freedom of geometry of the products and internal structures. There are also some limitations and problems, deriving from stopping the process during the production. By restarting the process, the building often continues with a thicker starting layer due to the deposition of two or more layers. The effect of skipped melting of layers is investigated in this paper. Maraging steel powder (MS1) was used in direct metal laser sintering (DMLS) process to produce samples with increased thickness of melted layers. The layer thickness was increased in 20 μm steps up to 160 μm with 0.5 mm offset between the increased thickness layers. Porosity caused by the uneven melting was measured by optical microscope, mechanical tests were carried out to quantify the effect of skipped layers and fractured surfaces were observed under SEM. We have found that the yield strength and tensile strength are not affected if the layer thickness is slightly increased locally in the laser sintered part, while even a small increase in porosity greatly reduces the total elongation of the specimen. The decrease of impact energy due to the porosities shows similar correlation with the decrease of percentage elongation at break. However, the Charpy impact test is much more sensitive to layer skipping, the lack of melted layers lowers the impact strength significantly.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.