Abstract
AbstractSilver‐titanium (Ag‐Ti) paste was used to prepare copper‐metalized aluminum nitride (AlN) substrate under 2 MPa by brazing. The effects of Ti concentration and brazing temperature on interfacial microstructure were evaluated. The evolution of the interfacial microstructure was examined based on six types of samples. The growth of TiN reaction layer at the AlN/Cu interface is from the island type to the continuous type, and then grows and thickens along the AlN grain boundary until the superficial AlN grains transform into TiN completely. The peeling strength increases as TiN reaction layer tends to be continuous, and reaches the maximum value of 34.6 N/mm. The copper‐metalized AlN substrates crack at the AlN ceramic, accompanied by the local plastic deformation of the copper foil, and then form the typical wave fracture. With further thickening of TiN reaction layer, the porous TiN layer becomes the weak link, and peeling strength decreased.
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