Abstract
The structure of high-purity copper and stabilizing copper of Cr-plated Nb3Sn-strands with different RRR (residual resistance ratio) values has been studied. Cr diffusion into peripheral layers of stabilizing Cu has been revealed. The variations of RRR and Cr content in Cu at annealing have been estimated. It is demonstrated that an additional drop of RRR may be caused by oxygen diffusion from Cr coating obtained by electroplating. Optimal regimes of the diffusion annealing of Cr-plated Nb3Sn-strands for ITER (International Thermonuclear Experimental Reactor) have been determined.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
