Abstract
The crystal orientation and residual stress development in AlN films deposited by dc planar magnetron sputtering on a glass substrate were investigated by atomic force microscopy (AFM) and X-ray diffraction. The microscopic surface morphology, the film thickness and the crystal orientation were investigated for films that were deposited at a constant N 2 gas pressure and a constant heating temperature of the substrate at various input powers. The following results were obtained: (1) the crystal grain size and the film thickness increased with increasing input power; (2) c-axis orientation was slightly good at high input power; (3) tensile residual stresses were obtained at low input power and large compressive stresses were obtained at high input powers of P=154 and 180 W.
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