Abstract
Ceramic technology has had an important role in microelectronics since 1960s and ceramic seems to be a continuously developing, mature technology. Recently, development of low temperature co-fired ceramic technology (LTCC) has been geared up due to the huge demand of miniaturisation of electronic components. New materials are being developed for extending the demand of wide range of dielectric properties of LTCC, minimization of shrinkage, cambering of LTCC, high quality of conductors and patterning etc. This paper deals with formulation of silver conductor inks for LTCC and the effect of ink organics on the LTCC in particular to cambering/warpage, microstructure development were studied and presented.
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