Abstract
Double patterning improves the development of immersion lithography, but it brings new challenges including the higher scanning velocity of wafer. In this paper, considering two typical injection types, the three-dimensional computational fluid dynamics model is developed to investigate the effect of injection parameters on immersion liquid during wafer scanning. By analyzing the velocity distribution of immersion flow and normal stress on the lens, the proper parameters of injection are proposed under the typical conditions, and the appropriate parameters which lead to effective renovation with low lens distortion are also given.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
