Abstract
ABSTRACTOwing to the presence of large fraction of grain boundaries, deformation-induced grain growth is commonly observed in fine-grained electrodeposited metals. Here we demonstrate that microcrystalline copper (d∼1–10 µm) with different textures produced by electrodeposition exhibit significant deformation-induced grain growth in tension by coalescence along with twin boundary migration and detwinning. Oriented growth with the formation of a cube texture was noted in the deformed samples. There was an increased fraction of twin boundaries with large angular deviation from Brandon's criterion during deformation.
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