Abstract
The effect of In addition on melting behaviors, microstructure and properties of Zn-5Al solder were investigated. It was found that addition of In decreasing the melting point of Zn-5Al solder. XRD analysis confirmed the presence of Indium in form of α-Zn+β-In solid solution. The segregation of In on grain boundary was observed. Segregation of In on grain boundary caused a significant decrease of strength of the Zn-5Al-In solder compared to Zn-5Al.
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