Abstract
During final high-temperature annealing in grain-oriented silicon steel, a few Goss grains grow exclusively fast and consume the matrix grains, which are related to the quality of the final product. The optimization of texture and microstructure in primary recrystallization is crucial to achieve the sharp Goss texture in grain-oriented silicon steel. The driving force for this phenomenon is the reduction of grain boundary area, which can be decribed as a reduction in grain boundary energy. The distribution of grain boundary and its energy determined by texture and microstructure of primary recrystallization are very important data to understand the optimization point. The hot band annealing is known to be a prerequisite for the high quality product in grain-oriented silicon steel. It can affect the evolution of microstructure and texture in primary recrystallization. In this study, the influence of the hot band annealing temperature on the texture and grain size distribution in primary recrystallization was investigated in detail.
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