Abstract
Silicon on insulator (SOI) structures (Si / SiO 2 layer / Si) were prepared by bonding the oxidised Si wafer with the hydrogen implanted one and a cleavage of the last wafer by the Smart Cut technique. Effect of high temperature and hydrostatic pressure (HT–HP) treatment at temperatures up to 1570 K and pressure up to 1.2 GPa, typically for 5 h, on the SOI structures was investigated by Transmission Electron Microscopy, X-Ray and photoluminescence measurements. The point and extended defects are created at HT–HP, especially near the SOI surface. That effect depends on the SOI preparation method and treatment conditions and is related to the hydrogen and pressure assisted oxygen outdiffusion from SiO 2 to the SOI surface and bulk.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
