Abstract
The purpose of this article is to study the effect of heat treatment on the interfacial microstructure and properties of the Cu-Al contact reaction brazed joint, and compare the results with a similar study performed on flash welding. The results show that the interfacial intermetallics in Cu-Al joint change from original two layers (Cu9Al4/CuAl2) to three layers (Cu9Al4/CuAl/CuAl2) both in contact reaction brazing and in flash welding. Some Kirkendall voids form during the growth of interfacial intermetallics. The voids in the contact reaction brazed joint form in the middle of interfacial intermetallic layer and lead a discontinuous crack after 500 h heat treatment. The voids in the flash welded joint form between copper and interfacial intermetallics and lead to a continuous crack after 500 h heat treatment. The growth rate of interfacial intermetallics conforms to the parabolic law for both joints. The relation between joint properties and the interfacial intermetallic thickness can be described by a linear function. The joint properties of contact reaction brazing are better than that of flash welding during the heat treatment. Therefore, contact reaction brazing is more preferred to maintain electrical stability and mechanical integrity of Cu-Al joint.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
