Abstract
The low temperature (216–415 °C) interdiffusion of vacuum-deposited Cr/Cu bilayers has been investigated by measuring the evolution of contact resistance. The activation energy of the diffusion process was measured. TCR and electrical resistance of the couples after the heat treatment period were measured as a function of heat treatment temperature. Some conclusions concerning the size-effect were obtained.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
