Abstract
The characteristics of resistive random access memory (RRAM) at the nanometer scale are increasingly important for RRAM cells with further miniaturization. We report the RRAM characteristics of NiO nanodots in the order of tens of nanometers. NiO nanodots of approximately 70 nm were created on a single-crystal Nb-doped SrTiO3 (Nb:STO) substrate by dip-pen nanolithography. For comparison, a NiO thin film was also deposited on the Nb:STO substrate by spin coating. To reduce the size of NiO nanodots, they were shattered by an atomic force microscope tip, obtaining nanodots of approximately 10 nm. Using a conductive atomic force microscope, we characterized the current according to the applied electric field of the NiO nanodots on the Nb:STO substrate with a capacitor configured of Pt/NiO/Nb:STO substrate. When compared with the NiO thin film, the forming voltage of the NiO nanodots decreased. In addition, the shattered NiO nanodots exhibited unipolar switching characteristics, and the forming and set/reset voltages decreased with the reduction in nanodot size. Furthermore, the NiO nanodots exhibited a substantially reduced forming and set/reset voltages after heat treatment in vacuum. We suggest that the oxygen-depleted layer formed on the surface of NiO nanodots by heat treatment plays a crucial role in the reduction of the forming and operation voltages.
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