Abstract
The galvanic corrosion of Cu/Al/Cu clad in 3.5% NaCl brine solution has been studied. No visible intermetallic compounds were found at the Cu/Al interface after roll-bonding, But Intermetallic layer grew up to 40μm after heat treatment 500°C for 10hours. The galvanic corrosion occurred significantly in the Al region in contact with Cu. The depth of the dissolved Al gradually decreased with distance away from the Cu/Al interface. Both IDR width and IDR depth increased steadily with increase of soaking time. The IDR width and depth of as-roll-bonded Cu/Al/Cu is far greater than those of heat-treated Cu/Al/Cu at 500°C for 10hours, suggesting the presence of intermetallic compounds influences the galvanic corrosion behavior.
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