Abstract
The contact resistance (R c) of the metal/YBCO interface has been studied in pressed indium, painted colloidal silver and thermally-evaporated silver contact pads. Indium contacts always show the highest resistance amongst these three systems. In thermally-evaporated Ag contacts, post-deposition thermal treatments show favourable effects on the reduction ofR c. Heat treatment in oxygen atmosphere in two steps is essential to reduce theR c values. Significant improvement in obtaining low resistivity contacts has been attributed to the diffusion of silver atoms to grain boundaries at the surface of YBCO and to the enrichment of oxygen-deficient layer at the interface during thermal treatment.
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