Year-end Sale % OFF 
Abstract
The structural state of the Cu-7.1% P and Cu-7.1% P-2% Ag solder melts are studied by viscometry and densitometry over a wide temperature range. The evolution of the microstructure of Cu-7.1% P solder ingots after heating of the melt at high temperatures is detected. The experimental results are interpreted using the concept of a microheterogeneous structure of a metallic liquid. 1 The alloy composition is given in wt %. 2 Trademark of a copper-phosphorus (Cu-7.1% P) solder.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
