Abstract
Surface enhanced Raman spectroscopy (SERS), electrochemical measurements, and contact angles were used to evaluate the effect of halides on Cu electrodeposition rates in the presence of 3-mercapto-1-propanesulfonate (MPS). The Cu(II) reduction rate was shown to decrease in the order Cl− > Br− > I−. In-situ SERS and contact angle measurements showed that adsorbed MPS will exhibit decreased gauche to trans (g:t) ratio and decreased hydrophobicity in the same order as the Cu(II) reduction rate. The amount of MPS in the gauche form, due to the hydrophobicity of the halide decorated surface, is a key factor in the Cu(II) reduction rate in acid sulfate baths containing the accelerator.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
