Effect of H2 Reduction Temperature on the Properties of Reduced Graphene Oxide and Copper Matrix Composites

Abstract

Reduced graphene oxide (RGO) and copper composites (RGO/Cu) were successfully fabricated based on a molecular-level mixing method (MLM). The composite powders were reduced in H2 at 350, 450, and 550 °C and then consolidated by spark plasma sintering (SPS) in order to evaluate the effect of H2 reduction temperature on the properties of the composites. The results indicate that the strengths of the composite decrease with the increase of H2 reduction temperature, while the electrical conductivity reaches its maximum at 450 °C and minimum at 550 °C. Hot rolling could benefit the electrical conductivity. The yield strength of the RGO/Cu composite reduced to 337 MPa at 350 °C. The electrical conductivity of the RGO/Cu composite reduced at 450 °C after hot rolling reaches 60.26% IACS. The properties of the RGO/Cu composites can be designed by adjusting the reduction degree of RGO and by hot rolling.