Abstract
The effect of surface residual stress and crack on bending strength of reaction bonded silicon carbide(RBSiC) after grinding was investigated.The residual stress of the ground surfaces were determined using X-ray diffraction.The sizes of strength controlling cracks were assessed using fracture mechanics approach.The investigations show that mechanical load,which has relation with grinding direction,phays a dominateve role in the grinding processes.and the measured residual stresses have a direction dependency.With increase of down feed from 0.9μm/s to 1.35μm/s,the bending strength is reasonably correlated with the surface residual stress and crack size.
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