Abstract

Graphene and its derivatives have excellent properties such as high surface area, thermal, and mechanical strength, and this fact made the researchers promote them as the possible filler material for fiber-matrix composite. The current research deals with validation on the effect of graphene oxide boron nitride filler over mechanical and thermal stability of epoxy glass fiber polymer matrix composite. The objective of this experimental investigation is to develop glass fiber reinforced polymer composites with hybrid filler addition. The matrix material selected is epoxy resin, whereas the glass fiber is selected as reinforcement, while boron nitride and graphene oxide are chosen as fillers. Compression moulding methodology is followed to develop the composites with the constant percentage of fiber loading, graphene oxide filler, and varying boron nitride content from 0 to 3 wt.% at an equal interval of 1 wt.%. The developed composite is analyzed for mechanical properties, and the fractured surface is analyzed through the scanning electron microscope. The addition of hybrid fillers enhances the fiber-matrix bonding strength and improves the thermal and mechanical properties up to a specific limit. Thermal gravimetric analysis was conducted to understand the thermal behavior of composite. The results revealed that the addition of filler improved the thermal stability of the composites.

Highlights

  • In recent years, polymer-based materials have attained substantial consideration in the fabrication of newer materials for higher appreciable electronics [1], packaging [2], and building applications

  • Glass fiber reinforced epoxy matrix composite with hybrid GO and BN fillers are fabricated through compression moulding and analyzed for tensile, flexural, and compressive properties

  • XRD and Raman spectroscopy results depict the proper exfoliations of GO through low cost modified hummers approach

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Summary

Introduction

Polymer-based materials have attained substantial consideration in the fabrication of newer materials for higher appreciable electronics [1], packaging [2], and building applications. Epoxy resins have gained more interest owing to their better basic and functional properties. Epoxy-based polymers are the thermosetting resins widely used in developing advanced materials owing to their outstanding properties, including durability, stiffness, low toxicity, and lightweight with lower cost. Excellent insulation with better cohesion properties of epoxy makes them recommend efficient material for insulation packing purposes. These resins are employed in various industrial applications that too mainly in the transport industries. The stiffness of epoxy resin primarily depends on the existence of crosslinking density. The occurrence of higher crosslink density might lead to the formation of brittle fracture with minor deformations [3, 4]

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