Abstract

Organic-inorganic halide perovskite (OIHP) thin films at the heart of the new perovskite solar cells (PSCs) are very brittle, limiting the mechanical reliability of PSCs. Here we show that fine-grained MAPbI3 (prototypical OIHP) films with grain size (~290 nm) smaller than the typical film thickness (~500 nm) tend to fracture intergranularly, resulting in low toughness (0.41 J.m−2). In contrast, MAPbI3/substrate interfacial fracture occurs in films with grains larger (~730 nm) than the film thickness, resulting in much higher toughness (1.14 J.m−2). Thus, coarse-grained OIHP films are deemed desirable for not only improved PSCs performance and stability but also mechanical reliability.

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