Abstract
We have investigated effect of filler particle morphology on the thermal properties of polyimide (PI) nanocomposite films. Gold nanoparticles with various morphologies (non-aggregated, aggregated, and nanorod) were selected as model fillers. To prevent nanoparticle agglomeration in a solvent (1-methyl-2-pyrrolidinone), the surfaces of the gold nanoparticles were modified with triphenylphosphine-3,3',3”-trisulfonic acid trisodium salt (TPPTS), creating the surface sulfonic acid groups. Experiments showed that the thermal diffusivity of the films increased with a large aspect ratio (i.e., nanorod) or aggregation. The addition of gold nanoparticles could reduce the coefficient of thermal expansion (CTE) of PI films in all cases, and the CTE was lowest when the particle size was smallest (i.e., non-aggregated nanoparticles). By considering the effects of the thermal conductivity of the nanocomposite and the interfacial area between the nanoparticles and polymer matrix, we found that increasing the interfacial area between the nanoparticles and polymer matrix by controlling the nanoparticle morphology could reduce the CTE of the nanocomposite more effectively than increasing the thermal diffusivity of the nanocomposite.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Colloids and Surfaces A: Physicochemical and Engineering Aspects
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
