Abstract
The product formed after the cream is spread between the wafer sheets is called a wafer block. The wafer block can have a minimum of 3 layers (2 sheets, 1 cream) and a maximum of 9 layers (5 sheets, 4 creams). The temperature of the wafer block before entering the cooling tower is 30-35°C. After the cooling process is completed, it cannot be reduced to the outlet temperature (~16°C) and the temperature is not homogeneously distributed. Especially the middle regions are hot. In this paper, the homogeneous temperature distribution is aimed at by using the CFD method. CFD analysis of three predetermined designs was performed using Solidworks / Flow Simulation software. The first design is the one currently used. In the second design, a design improvement has been made to reduce the effect of vortices in dead zones. In the third design, a design improvement was made to positively affect the flow rate in the upper region where the evaporator and fan are located. In the second design, the temperature difference on the wafer block is reduced by 0.02°C compared to the current design. The third design decreases by 0.13°C compared to the second design.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
