Abstract
Vacuum evaporated chromium thin films on glass substrates were evaluated for adhesion by the scratch test as a function of partial pressures of Ar, H2, CH4, O2, CO, and CO2 deliberately introduced during chromium deposition. Partial pressures examined ranged from 0.67 to 13.3 mPa. Initial adhesion results suggest a reactive evaporation process of chromium with O2, CO, and CO2 backfills and are in agreement with the theory of an oxide layer formation causing increased initial adhesion. Gas/chromium atom impingement ratios corresponding to noticeably improved adhesion are reported. Time dependent adhesion results reveal a distinction in adhesion behavior between films deposited in O2, CO, and CO2 backfills and those deposited in Ar, CH4, and H2 backfills. Possible mechanisms for this behavior are discussed.
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