Abstract
The effects of Ga on the properties of Ag50CuSn12 and brazed joints were studied. The results show that Ga can reduce the melting temperature of the Ag50CuSn12 and improve its wettability. With the increase of Ga content, the spreading area of the solder increases first and then decreases. And the spreading area is the largest when the content of Ga is 3 wt%, which is 48% higher than that without Ga. Ga plays an important role in grain refinement of weld microstructure. The size of the block particles in the weld decreases accompanied by the increase of Ga. The fine strip grains increase is evenly distributed. The refinement effect is also the best when the Ga content is 3 wt%. For this reason, the shear strength of the brazed joint of Al2O3 and oxygen-free copper increases first and then decreases. When the Ga content is 3 wt%, the shear strength is the highest, which is 2.2 times that of the joint without Ga.The analysis suggests that the incorporation of Ga lowers the melting point of the solder, improves its oxidation resistance, and reduces its surface tension and viscosity, thereby enhancing its wettability and diffusivity. However, excessive Ga can hinder the solder's spread.
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