Abstract
This study investigated the stress and strain behavior caused in the forming process via simulation analysis using the finite element method, for suppressing punch shoulder and head plate thickness reduction die shoulder stress concentration by controlling the friction conditions. The following findings were obtained: The thickness of the blank head and punch shoulder decreased with the forming process. Due to the increase in the coefficient of friction with the punch side, the plate thickness reduction ratio decreases, and is the lowest when it is close to non-lubrication; Stress concentration occurs at the die shoulder with forming processing. With the increase in the friction coefficient value, forming limit parameter (FLP) increases slightly, but as it does not reach the limit value of 1, the forming process can be safely performed without mechanical damage; When the formability is comprehensively evaluated using the plate thickness reduction ratio and FLP, the friction coefficient μ = 0.4 to 0.5 is reasonable.
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