Abstract
Microlamination involves the patterning, registration, and bonding of thin layers of material, called laminae, to produce highly paralleled, spatially intensified microchannel systems for the bulk processing of mass and energy. A Thermally Enhanced Edge Registration (TEER) technique has been developed for precision aligning large numbers of laminae in diffusion-bonding processes based on the differential thermal expansion between the laminae and bonding fixture. However, fixture tolerances necessary to promote buckle-free TEER bonding have been found to be very small (below 10 μm). This research focuses on the development of a new approach to thermal registration based on fixture compliance to permit looser fixture tolerances. An analysis based on both fin-buckling behavior and the compliance of the fixture is implemented to investigate the tolerance limit of a compliant TEER fixture. Experiments are conducted to verify the theoretical model. Results show that a compliant fixture can permit an acceptable tolerance limit in TEER.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
