Effect of fillers on the piezocapacitive behaviour of silicone rubber particulate composites

Abstract

Robotics and fluid dynamics applications have created demand for development of electronic skins with embedded pressure sensors. These applications require simple and low-cost fabrication processes with large area deployment. Both structured and unstructured material approaches to sensor development have been followed. Among the various sensing mechanisms, piezo capacitive transduction is superior. This paper reports the influence of fillers on the piezo capacitive characteristics of unstructured solid silicone rubber composites. Dielectric, conductive and conductive-dielectric fillers were incorporated into solid silicone rubber and fabricated using high temperature compression moulding to form dielectric-dielectric, conductive-dielectric and conductive-dielectric dielectric composites. The results reveal that piezo capacitive sensitivity varies with filler type, filler loading, curing agent loading, mixing time and curing temperature. The experiments reveal improved normalized capacitance with pressure characteristics of linearity and sensitivity of 3.9 × 10−3 (kPa)−1 in the 0–20 kPa range of pressure. These composites are thus candidate materials for flexible pressure sensing applications.