Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip–chip interconnection

Abstract

The dielectric property of anisotropic conductive film (ACF) as an interconnect materials in the flip–chip joints is becoming important concern for device packaging solution at high-frequency due to low parasitic effect on the signal transfer. The effects of non-conductive, dielectric filler content on dielectric properties of ACA materials, like dielectric constant, loss factor and loss tangent, and conductivity at high-frequency were investigated. Frequency is dominating factor in determining dielectric constant, loss factor, and conductivity. However, the filler content is dominant only on dielectric constant, not on the loss factor, and conductivity at low-frequency range. The effect of low dielectric constant (low- k) filler addition on high-frequency behavior of ACF interconnection in flip–chip assembly was also investigated. Impedance parameters of low- k ACF with Ni filler and low- k SiO 2 filler extracted from measurement were compared with that of conventional ACF with only Ni filler. The resonant frequency of conventional ACF flip–chip interconnect was 13 GHz, while the resonant frequency of low- k ACF including low- k SiO 2 filler was found at 15 GHz. This difference is originated from capacitance decrease of polymer matrix between bump and substrate pad due to change in dielectric constant of polymer matrix, which was verified by measurement-based modeling. The high-frequency property of the conductive adhesive flip–chip joint, such as resonant frequency can be enhanced by low- k polymer matrix.