Abstract
Copper coating was manufactured by super-sonic flow deposition method and especially two kinds of feedstock powders with different powder particle size distribution (A: 9∼53 μm, B: 4∼23 μm) and grain characteristic in the powder (A: fine and inhomogeneous, B: coarse) were used for the deposition. It was found that the use of small particle distributed feedstock powder B could decrease the surface roughness and porosity of the coating layer. After annealing, the micro-hardness of the super-sonic flow deposited copper coating decreased significantly with increasing annealing temperature. The abrupt decrease in hardness exactly corresponded to the starting annealing temperature of primary recrystallization. It was also suggested that the hardness of Cu coating layer mainly attributed to grain size, shape and the bonding of particles but not a change in the porosity of the coating layer. The electrical conductivity and thermal conductivity of powder B coating were higher than those of powder A. The superiority of electrical and thermal conductivities of B coating layer could be related not only to the large size and homogeneity of grains, and strong bonding of particle-particle interface but also to a decrease of porosity content, caused by small size and homogeneous distribution of powder B.
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