Effect of extrusion and introduction of Cu wire on the microstructure and mechanical properties of the Mg matrix

Abstract

Composite extrusion of AZ31 Mg alloy and T2 Cu wire was carried out. The interface characteristics, microstructure evolution and mechanical behavior of as-homogenized, single Mg and Mg/Cu composites were analyzed in detail by various analytical methods. The experimental results show that the interface between Cu wire and Mg alloy matrix is better. With the introduction of extrusion and Cu wire, the grains of Mg matrix are continuously refined, the proportion of LAGBs is gradually reduced, and the texture strength is obviously weakened. The Mg matrix in Mg/Cu composites is more conducive to activating various non-basal slip systems than single Mg. Compared with the as-homogenized Mg alloy sample, the elongation (EL), tensile strength (TS) and yield strength (YS) were improved by extrusion and introduction of Cu wire.