Abstract
In the present study, a new tapering heat pipe design had been developed to enhance the thermal performances. Boiling visualization in the tapering heat pipe is investigated to provide the detailed information of bubbles nucleation. Experiment was conducted in the tapering heat pipe with variation of the evaporator (d) to condenser (D) diameter ratio. The values of d/D are varied at 1/1; 1/2; 1/3 and 1/4. Heat load was generated at the evaporator section using heater DC-Power supply at 30, 40 and 50 Watt. The visualization technique was developed by using a transparent glass tube and the images of boiling bubbles were captured by SLR camera. The glass tube inclination is 45° and integrated with the NI-9211 and c-DAQ 9271 module. K-type thermocouple was set at the evaporator and condenser sections for measurement of boiling temperatures in the tapering heat pipe. Based on the results, it can be noted that variations of heat load and diameter ratio (d/D) of the evaporator and condenser affect the size and shape of boiling bubbles, as well as the nucleation temperature on the tapering heat pipe. The heat transfer coefficient tends to increase at a heat load of 50 W and diameter ratio d/D=1/4.
Highlights
The development of electronic technology was as the rapid and the increased heat flux, there request to be an appropriate solution
The heat pipe is a passive device of heat transfer suitable for solving high heat flux
The development of heat pipe technology has been widely perceived, one of which is used as a cooling system in electronic components as heat dissipation, especially on the microprocessor that produces greater heat flux due to increased performance and smaller dimension
Summary
The development of electronic technology was as the rapid and the increased heat flux, there request to be an appropriate solution. The heat pipe is a passive device of heat transfer suitable for solving high heat flux. This is the device of heat transfer from the heat source as the evaporator to the heat sink as the dissipation of heat in a relatively long time span through evaporation of latent heat of the working fluid. The development of heat pipe technology has been widely perceived, one of which is used as a cooling system in electronic components as heat dissipation, especially on the microprocessor that produces greater heat flux due to increased performance and smaller dimension. The high capacity of the microprocessor is result in increased heat and is not capable of being absorbed by the conventional heat sinks
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