Abstract
Ethylenediamine (EDA) greatly affects the phenomenon of anomalous codeposition observed in the nickel‐iron electrodeposition system. EDA increases the Ni/Fe ratio of the deposit when the bath is chloride based and the pH is at least 5. Ion microprobe analysis indicates that EDA is incorporated in the deposit. It is hypothesized that EDA adsorbs on the deposit surface and serves as a bridge for deposition in preference to that for , which forms less stable complexes with EDA. Chloride ion in the bath is necessary for the adsorption of EDA and thus the relative increase in the nickel deposition rate. © 1999 The Electrochemical Society. All rights reserved.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
