Abstract

Complex electronics devices are becoming more sensitive to electrostatic discharge (ESD). These components are being developed with higher density (extra memory bits per unit volume) and are becoming faster (MHz, GHz, THz, etc.). These upgrades in technology do not come without a technological price. By enhancing the products' performance to meet the users' demands and requirements, one drawback is the reduction in the ESD sensitivity voltage levels. Indirect and direct air/contact discharge test has been conducted on the ALS-SDA-CPLD/FPGA trainer kit linked to the digital to analog converter (DAC) module. The Field Programmable Gate Arrays (FPGA) and Complex Programmable Logic Devices (CPLD) are found to be very ESD sensitive. The FPGA 3s50 IC was affected during the contact discharge to the input pin. There was damage to the bond pad as well as the metal top layer was damaged. The DAC ICs were affected during the ESD discharge one due to direct ESD effects and the other due to indirect ESD effects. There was dielectric breakdown damage observed in the CPLD 9572 IC.

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